WS889 Water Soluble Solder Paste

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WS889 Water Soluble Solder Paste

WS889 Solder Paste

WS889 water soluble lead free solder paste is formulated to provide minimal graping and excellent wetting qualities. WS889 displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65-85 F) and relative humidity (25-65 % RH). Residues are amber in color and can be cleaned using warm water. WS889 is a good printing paste that produces good cosmetics with clean and shiny solder joints. This product is classified ORH1.

Attributes

Excellent volume transfer efficiency
High resistance to slump and dry-out, even in extreme humidity condition and RH
High speed stencil printing up to 100mm/sec
Excellent low voiding performance that exceeds IPC Class II requirement
Clear residue
Very cleanable paste residue with hot DI water (120-140F)

Production Details

Shelf Life: Nine months

Standard Lead Time

4 work days

Available Containers

30 gram syringe
100 gram syringe
250 gram jar
500 gram jar
500 gram cartridge
600 gram cartridge
1300 gram cartridge
7 pound cartridge

Related Documents for WS889

pdf Technical Data Sheet

pdf Material Safety Data Sheet

pdf Surface Insulation Resistance (SIR Testing)

pdf Electromigration Testing