NC722 No Clean Solder Paste

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NC722 No Clean Solder Paste

NC722 Solder Paste

NC722 no clean solder paste is a new generation halide free, rosin-based chemistry. NC722 was specially designed to be used with low temperature alloys like Sn 42 / Bi 58. This paste offers an excellent open time, extended abandon time and good soldering activity with all surface finishes. Residues left behind are clear and maintain a virtually indefinite pin probability life. NC722 is classified ROL0.

Attributes

Excellent print volume consistency with surface area ratios (SAR) as low as 0.50 when used with the NanoSlic stencil technology
Non-hygroscopic formulation suitable for high RH areas
Wide reflow window with good solderability on various PCB surface finishes
Unlimited pin probability and clear post-process residues
Low voiding and high reliability composition
Formulated for fast printing
Designed for low temperature alloys

Production Details

Shelf Life: Nine months

Standard Lead Time

4 work days

Available Containers

30 gram syringe
100 gram syringe
250 gram jar
500 gram jar
500 gram cartridge
600 gram cartridge
1300 gram cartridge
7 pound cartridge

Related Documents for NC722

pdf Technical Data Sheet

pdf Material Safety Data Sheet